Development Tools
To improve the efficient of development projects, we offer a range of engineering tools and simulation services based on both own developed software solutions and prove open-source simulation platforms.
One of our key tools is the Output Current Simulator, which predicts application-relevant output current capability for IGBTs, diodes, and SiC MOSFETs. Based on device loss data and application-specific parameters such as switching frequency, thermal impedance, and junction temperature limits, the simulator calculates the achievable operating current under realistic application conditions.
The figure above shows a typical example in which the junction temperature ripple of an IGBT has been calculated for a PWM-controlled application. Such analyses help engineers understand the interaction between condunction and swithing losses beyond what is possible looking at a simple trade-off curve. This enables informed design decisions early in the development process.
Our sollutions include
- Output current and thermal capability calculations for power semiconductor devices
- SPICE simulations for circuit analysis and investigation of application-related issues
- Data analysis and visualization tools for characterization and reliability data
- Thermal FEM simulations of Rth and Zth characteristics using open-source simulation packages such as Elmer shown in the picture below
